On October 26th, Fred C. LEE, an academician of the American Academy of Engineering, a foreign academician of the Chinese Academy of Engineering, and a distinguished professor at the Virginia Tech University in the United States, was appointed as an honorary professor at HUST, and also gave a special report on the IEEE Power Electronics Society (“PELS”) Wuhan Chapter.
At the ceremony, Prof. Wen Jinyu, Dean of the SEEE introduced the basic situation of the school and the college. Vice President Zhang Xinliang awarded the appointment certificate of honorary professor to Professor Li Zeyuan. Professor Li Zeyuan delivered a speech of thank-you and introduced the operation experience of CPES. After the meeting, Professor Li Zeyuan and the professor of the SEEE discussed how to deepen the cooperation and exchanges between the two sides and visited the Electrical College Building and the Applied Electronic Engineering Department Building.
In the special report of IEEE PELS Wuhan Chapter, Professor Li Zeyuan made a special report on "The Next Generation of Power Supplies". The report was held in the lecture hall of the No. 1 Building of Huazhong University of Science and Technology. Professor Li Zeyuan first compared the development history of the power electronics industry and the microelectronics industry. In contrast, the development of the power electronics discipline is slow, reflecting that it is “more difficult, more opportunities, and a broader vision”. And then analyzed the advantages and problems to be solved in the new generation of wide bandgap semiconductor devices. Finally, Professor Li Zeyuan talked about the integration and modularization of passive components in power electronic equipment.
Dr. Lee is a University Distinguished Professor Emeritus and Founder and Director Emeritus of CPES, a preeminent academic center in power electronics research at Virginia Tech. Dr. Lee's research interests include high-frequency power conversion, magnetics and EMI, distributed power systems, renewable energy, power quality, high-density electronics packaging and integration, and modeling and control.